Multi-height finfets with coplanar topography background

ABSTRACT

A semiconductor structure is provided that has semiconductor fins having variable heights without any undue topography. The semiconductor structure includes a semiconductor substrate having a first semiconductor surface and a second semiconductor surface, wherein the first semiconductor surface is vertically offset and located above the second semiconductor surface. An oxide region is located directly on the first semiconductor surface and/or the second semiconductor surface. A first set of first semiconductor fins having a first height is located above the first semiconductor surface of the semiconductor substrate. A second set of second semiconductor fins having a second height is located above the second semiconductor surface, wherein the second height is different than the first height and wherein each first semiconductor fin and each second semiconductor fin have topmost surfaces which are coplanar with each other.

BACKGROUND

The present application relates to a non-planar semiconductor device anda method of forming the same. More particularly, the present applicationrelates to a FinFET device and a method of forming the same.

With the increasing down-scaling of integrated circuits and increasinglydemanded requirements for a higher speed of integrated circuits,transistors need to have higher drive currents with increasingly smallerdimensions. The use of non-planar semiconductor devices such as, forexample, FinFETs, trigate and gate-all around semiconductor nanowirefield effect transistors (FETs) is the next step in the evolution ofcomplementary metal oxide semiconductor (CMOS) devices since suchdevices can achieve higher drive currents with increasingly smallerdimensions.

SUMMARY

In one aspect of the present application, a semiconductor structure isprovided that contains semiconductor fins having variable heightswithout any undue topography. Specifically, a semiconductor structure isprovided that includes a semiconductor substrate comprising a firstsemiconductor surface and a second semiconductor surface, wherein thefirst semiconductor surface is vertically offset and located above thesecond semiconductor surface. An oxide region is located directly on thefirst semiconductor surface and/or the second semiconductor surface. Afirst set of first semiconductor fins having a first height is locatedabove the first semiconductor surface of the semiconductor substrate. Asecond set of second semiconductor fins having a second height islocated above the second semiconductor surface, wherein the secondheight is different than the first height and wherein each firstsemiconductor fin and each second semiconductor fin has a topmostsurface, and the topmost surfaces of the first and second semiconductorfins are coplanar with each other.

In one embodiment, the semiconductor structure includes a bulksemiconductor substrate comprising a first semiconductor surface and asecond semiconductor surface, wherein the first semiconductor surface isvertically offset and located above the second semiconductor surface. Afirst oxide region is located directly on the first semiconductorsurface and a second oxide region is located directly on the secondsemiconductor surface. In accordance with this embodiment of the presentapplication, the first oxide region has a topmost surface that isvertically offset and located above a topmost surface of the secondoxide region. A first set of first semiconductor fins having a firstheight is located directly on the topmost surface of the first oxideregion and a second set of second semiconductor fins having a secondheight is located directly on the topmost surface of the second oxideregion, wherein the second height is greater than the first height andwherein each first semiconductor fin and each second semiconductor finhas a topmost surface, and the topmost surfaces of the first and secondsemiconductor fins are coplanar with each other.

In another aspect of the present application, a method of forming asemiconductor structure containing semiconductor fins having variableheights without any undue topography is provided. Specifically, themethod includes providing a semiconductor substrate comprising a firstsemiconductor surface and a second semiconductor surface, wherein thefirst semiconductor surface is vertically offset and located above thesecond semiconductor surface, and wherein a pair of spaced apartsemiconductor mandrel structures is present on a portion of the firstsemiconductor surface of the semiconductor substrate. Next, an oxideregion is formed on the first semiconductor surface and/or the secondsemiconductor surface. A first set of first semiconductor fins having afirst height is formed from one sidewall surface of each semiconductormandrel structure and located above the first semiconductor surface, anda second set of second semiconductor fins having a second height isformed from another sidewall surface of each semiconductor mandrelstructure and located above the second semiconductor surface, whereinthe second height is different than the first height, and wherein thefirst semiconductor fin and the second semiconductor fin each have atopmost surface and wherein the topmost surface of the firstsemiconductor fin coplanar with the topmost surface of the secondsemiconductor fin. Next, each semiconductor mandrel structure is removedfrom atop portions of the first semiconductor surface.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a pictorial representation (through a cross sectional view)illustrating an initial structure including a semiconductor substratehaving a layer of a hard mask material located thereon in accordancewith one embodiment of the present application.

FIG. 2 is a pictorial representation (through a cross sectional view)illustrating the initial structure of FIG. 1 after forming a pluralityof openings through the layer of hard mask material and into a portionof the semiconductor substrate.

FIG. 3 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 2 after forming semiconductor mandrelstructures on exposed sidewall surfaces of the semiconductor substrate.

FIG. 4 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 3 after filling remaining portions ofthe opening within the layer of hard mask material and the semiconductorsubstrate with a dielectric material that differs from the hard maskmaterial.

FIG. 5 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 4 after removing remaining portionsof the layer of hard mask material and recessing exposed portions of thesemiconductor substrate to provide a second recessed surface below afirst recessed surface of the semiconductor substrate which includes thesemiconductor mandrel structures and the dielectric material.

FIG. 6 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 5 after removing the dielectricmaterial from the structure.

FIG. 7 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 6 after forming oxide regions on thefirst and second recessed surfaces of the semiconductor substrate and anoxide cap on each semiconductor mandrel structure.

FIG. 8 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 7 after forming semiconductor fins oneach oxide region and on sidewall surfaces of each semiconductor mandrelstructure.

FIG. 9A-9B are pictorial representations (through cross sectional views)illustrating some exemplary fin-containing structures that can be formedin the present application in which an oxide region is formed only onone of the recessed surfaces, but not the other recessed surface.

FIG. 10 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 8 after removing each of thesemiconductor mandrel structures and forming an insulating layer onexposed surfaces of the semiconductor substrate previously occupied bythe semiconductor mandrel structures.

FIG. 11 is a pictorial representation (through a cross sectional view)illustrating the structure of FIG. 10 after forming a gate structurestraddling each semiconductor fin.

FIG. 12 is a pictorial representation (through a top down view)illustrating a static random access memory (SRAM) device formed usingthe processing steps of the present application.

DETAILED DESCRIPTION

The present application, which provides a FinFET device and a method offorming the same, will now be described in greater detail by referringto the following discussion and drawings that accompany the presentapplication. It is noted that the drawings of the present applicationare provided for illustrative purposes and, as such, they are not drawnto scale. In the drawings and the description that follows, likeelements are referred to by like reference numerals. For purposes of thedescription hereinafter, the terms “upper”, “lower”, “right”, “left”,“vertical”, “horizontal”, “top”, “bottom”, and derivatives thereof shallrelate to the components, layers and/or elements as oriented in thedrawing figures which accompany the present application.

In the following description, numerous specific details are set forth,such as particular structures, components, materials, dimensions,processing steps and techniques, in order to provide a thoroughunderstanding of the present application. However, it will beappreciated by one of ordinary skill in the art that the presentapplication may be practiced with viable alternative process optionswithout these specific details. In other instances, well-knownstructures or processing steps have not been described in detail inorder to avoid obscuring the various embodiments of the presentapplication.

A FinFET device is one architecture that can provide higher drivecurrents with increasingly smaller dimensions. As used throughout thepresent application, the term “fin” refers to a semiconductor materialwhich is employed as the body of a semiconductor device, in which a gatestructure straddles the semiconductor material such that charge flowsalong the channel on the two sidewalls of the semiconductor material andoptionally along the top surface of the semiconductor material. Onedrawback of prior art FinFET devices is the device width quantization,i.e., the effective device width has to be an integral number of Fins.Width quantization puts severe constraints on device design,particularly for static random access memory (SRAM) devices in which itis highly desired to customize the ratio between pull-up, pull-down andpass gate transistors. In bulk FinFET devices, one could recess theshallow trench isolation region to get different Fin widths, but bulkFinFET devices have difficulty in achieving low leakage because bulkFinFET devices require junction isolation and thus have inherently highjunction/gate induced drain leakage (GIDL).

Semiconductor-on-oxide (SOI) FinFET devices overcome the high leakageproblem. However, the Fin width of an SOI FinFET device is predeterminedby the thickness of the SOI layer, i.e., the topmost semiconductorlayer, of the SOI substrate. Starting with different SOI thicknesscauses topography which is undesirable for manufacturing. Anotherdisadvantage of SOI FinFET devices is high substrate cost in comparisonto bulk semiconductors.

The present application provides a method for forming SOI finFET devicesstarting with a bulk semiconductor substrate wherein various Fin heightscan be achieved without introducing undesirable topography. In someembodiments, the present application provides a finFET SRAM in whichnFET fins are taller than pFET fins. In other embodiments, the presentapplication can provide SOI fins and bulk SOI fins on the samesemiconductor substrate.

Referring first to FIG. 1, there is illustrated an initial structureincluding a semiconductor substrate 10 having a layer of a hard maskmaterial 12 located thereon in accordance with one embodiment of thepresent application.

In accordance with the present application, the semiconductor substrate10 that is employed in the present application is a bulk semiconductorsubstrate. By “bulk” it is meant the entirety of the semiconductorsubstrate 10 from one surface to an opposite surface is composed of asemiconductor material. The semiconductor substrate 10 can be comprisedof any semiconductor material including, but not limited to, Si, Ge,SiGe, SiC, SiGeC, InAs, GaAs, InP or other like III/V compoundsemiconductors. Multilayers of these semiconductor materials can also beused as the semiconductor material of the semiconductor substrate 10. Inone embodiment, the semiconductor substrate 10 comprises a singlecrystalline semiconductor material, such as, for example, singlecrystalline silicon. In other embodiments, the semiconductor substrate10 may comprise a polycrystalline or amorphous semiconductor material.

In some embodiments of the present application, the semiconductorsubstrate 10 may be doped, undoped or contain doped and undoped regionstherein. For clarity, the doped regions are not specifically shown inthe drawings of the present application. Each doped region within thesemiconductor material may have the same, or they may have differentconductivities and/or doping concentrations. The doped regions that arepresent in the semiconductor material of semiconductor substrate 10 canbe formed utilizing a conventional ion implantation process or gas phasedoping.

The initial structure shown in FIG. 1 also includes a layer of hard maskmaterial 12 present on an exposed surface of the semiconductor substrate10. The layer of hard mask material 12 can be comprised of a dielectrichard mask material such as, for example, an oxide, nitride, and/oroxynitride. In one embodiment, the layer of hard mask material 12 can becomprised of silicon oxide, a silicon nitride and/or a siliconoxynitride. In one embodiment, the layer of hard mask material 12 can beformed utilizing a thermal process such as, for example, a thermaloxidation or a thermal nitridation process. In another embodiment, thelayer of hard mask material 12 can be formed by a deposition processsuch as, for example, chemical vapor deposition (CVD), or plasmaenhanced chemical vapor deposition (PECVD). The thickness of the layerof hard mask material 12 can be from 5 nm to 50 nm, although lesser andgreater thicknesses can also be employed.

Referring now to FIG. 2, there is illustrated the initial structure ofFIG. 1 after forming a plurality of openings 14 through the layer ofhard mask material 12 and into a portion of the semiconductor substrate10. The remaining portions of the layer of hard mask material 12 arehereinafter referred to as hard mask material portions 13.

The plurality of openings 14 can be formed by lithography and etching.Lithography can include forming a photoresist (not shown) on an exposedsurface of the layer of hard mask material 14, exposing the photoresistto a desired pattern of radiation, and then developing the exposedphotoresist with a conventional resist developer to provide a patternedphotoresist atop the layer of hard mask material 12. At least one etchis then employed which transfers the pattern from the patternedphotoresist through the layer of hard mask material 12 and into portionsof the semiconductor substrate 10. In one embodiment, the etch used forpattern transfer may include a dry etch process such as, for example,reactive ion etching, plasma etching, ion beam etching and laserablation. In another embodiment, the etch used for pattern transfer mayinclude a wet chemical etchant such as, for example, KOH or TMAH. In yetanother embodiment, a combination of a dry etch and a wet chemical etchmay be used to transfer the pattern. In one embodiment, the pattern isfirst transferred from the patterned photoresist into the layer of hardmask material 12, the patterned photoresist is then removed, and thenthe pattern is transferred from the now patterned layer of hard maskmaterial into portions of the semiconductor substrate 10. In someembodiments, the patterned photoresist can remain throughout the entiretransfer process. The patterned photoresist can be removed utilizing aconventional resist stripping process such as, for example, ashing.

After pattern transfer through the layer of hard mask material 12 andinto portions of the semiconductor substrate 10, openings 14 areprovided into the semiconductor substrate 10. Each opening 14 can have afirst recessed surface 10 r ₁ as compared to non-recessed surfaces ofthe semiconductor substrate 10. The non-recessed surfaces of thesemiconductor substrate 10 can be referred to herein as mesa surfaces 10m. The mesa surfaces 10 m represent the original topmost surface ofsemiconductor substrate 10. As is shown, hard mask material portions 13are present on top of the mesa surfaces 10 m. In some embodiments, andas shown, the hard mask material portions 13 have sidewall surfaces thatare vertically coincident with sidewall surfaces of patternedsemiconductor substrate 10 that are defined by each opening 14.

In one embodiment of the present application, each opening 14 can have awidth, as measured from one exposed sidewall of the semiconductorsubstrate 10 to another exposed sidewall of the semiconductor substrate10, of from 40 nm to 200 nm. In another embodiment of the presentapplication, each opening 14 can have a width, as measured from oneexposed sidewall of the semiconductor substrate 10 to another exposedsidewall of the semiconductor substrate 10, of from 40 nm to 120 nm.

In one embodiment of the present application, each opening 14 can have adepth, as measured from first recessed surface 10 r ₁ to mesa surface 10m, of from 50 nm to 250 nm. In another embodiment of the presentapplication, each opening 14 can have a depth, as measured from firstrecessed surface 10 r ₁ to mesa surface 10 m of from 50 nm to 100 nm.

Referring now to FIG. 3, there is illustrated the structure of FIG. 2after forming semiconductor mandrel structures 16 on exposed sidewallsurfaces of the semiconductor substrate 10. As is shown, a pair ofspaced apart semiconductor mandrel structures 16 is provided in eachopening 14. Each semiconductor mandrel structure 16 that is formed has abottommost surface on a portion of the first recessed surface 10 r ₁ ofthe semiconductor substrate 10. As such, a gap 15 remains between eachpair of spaced apart semiconductor mandrel structures 16 formed withineach opening 14. As also shown, each semiconductor mandrel structure 16has a topmost surface that is coplanar with the mesa surface 10 m of thesemiconductor substrate 10. Since hard mask material portions 13 arepresent atop the mesa surfaces, the semiconductor mandrel structures 16do not extend upon the mesa surfaces 10 m of the semiconductor substrate10.

Each semiconductor mandrel structure 16 comprises a semiconductormaterial that differs from the semiconductor material of thesemiconductor substrate 10. Examples of semiconductor materials that canbe used in providing each semiconductor mandrel structure 16 include,but are not limited to, Si, Ge, SiGe, SiC, SiGeC, InAs, GaAs, InP orother like III/V compound semiconductors. In one embodiment of thepresent application, each semiconductor mandrel structure 16 maycomprise a same semiconductor material which differs from thesemiconductor material of the semiconductor substrate 10. In anotherembodiment of the present application, each semiconductor mandrelstructure 16 may comprise a different semiconductor material, whereineach different semiconductor material providing the semiconductormandrel structures 16 is different from the semiconductor material ofthe semiconductor substrate 10. In yet another embodiment, a first setof semiconductor mandrel structures 16 may comprise a same semiconductormaterial, while a second set of semiconductor mandrel structures 16 maycomprise a different semiconductor material than the first set ofsemiconductor mandrel structures 16. In any of the various embodimentsmentioned above, the semiconductor material used in providing thesemiconductor mandrel structures 16 is different from the semiconductormaterial employed as the semiconductor substrate 10.

In one example of the present application, and when the semiconductorsubstrate 10 is comprised of silicon, the semiconductor mandrelstructure 16 can be comprised of a silicon germanium alloy. In such anembodiment, the silicon germanium alloy that provides each semiconductormandrel structure 16 can have a germanium content of from 30 atomic %germanium to 60 atomic % germanium. Other germanium contents for thesilicon germanium alloy that provides each semiconductor mandrelstructure 16 may also be used.

In some embodiments, each semiconductor mandrel structure 16 may benon-doped, i.e., comprise an intrinsic semiconductor material. In otherembodiments, each semiconductor mandrel structure 16 is doped with ann-type of p-type dopant. In some embodiments, a first set ofsemiconductor mandrel structures 16 may be intrinsic, while a second setof semiconductor mandrel structures 16 may be doped.

Each semiconductor mandrel structure 16 is formed by an epitaxial growth(or epitaxial deposition) process. The term “epitaxial growth and/ordeposition” means the growth of a semiconductor material on a depositionsurface of a semiconductor material, in which the semiconductor materialbeing grown has the same (or nearly the same) crystallinecharacteristics as the semiconductor material of the deposition surface.In accordance with an embodiment of the present application, eachsemiconductor mandrel structure 16 can be epitaxially grown at atemperature from 300° C. to 1000° C. using a gas mixture that includesat least one semiconductor source gas. In one example, eachsemiconductor mandrel structure 16 can be epitaxially grown at atemperature from 600° C. to 800° C. In one embodiment of the presentapplication, each semiconductor mandrel structure 16 can be epitaxiallygrown utilizing low pressure chemical vapor deposition (LPCVD). In someembodiments of the present application, the process pressure iscontrolled in a way allowing only for deposition on (110) sidewalls toform each semiconductor mandrel structure 16, with no or almost nodeposition on the first recessed surface 10 r ₁. In one example, theprocess pressure can be 200 torr.

In one embodiment the crystal orientation dependence of the epitaxyprocess is used to form the semiconductor mandrel structures 16 on theexposed sidewalls of the semiconductor substrate 10 but not on the firstrecessed surface 10 r ₁. For example, if the semiconductor substrate 10is selected so that it has a top surface orientation of (110) andsidewall orientation of (100), epitaxy processes can be tailored so thatthe semiconductor mandrel structure 16 is deposited on the (100)sidewalls but not on the (110) recess.

In yet another embodiment, the semiconductor mandrel structure 16 can bedeposited on the sidewalls of the semiconductor substrate 10 as well asthe first recessed surface 10 r ₁. An etch process such as, for example,reactive ion etching, can then be used to remove a portion of thesemiconductor mandrel material that was deposited on the first recessedsurface 10 r ₁.

In yet another embodiment, the first recessed surface 10 r ₁ of thesemiconductor substrate 10 is modified before the epitaxy process suchthat the semiconductor mandrel structures 16 are not deposited on thefirst recessed surface 10 r ₁. For example, ion implantation with aheavy ion such as Ge, Xe, or Si can be used to amorphize thesemiconductor substrate at the first recessed surface 10 r ₁. During theepitaxy process the semiconductor mandrel structure 16 is not depositedon the amorphized region or deposited in an amorphous or polycrystallineform and is removed in a cyclic deposition and etching epitaxy process.

In embodiments in which a dopant is present in the semiconductor mandrelstructures 16, the dopant can be introduced during the epitaxial growthprocess or after epitaxial growth utilizing one of ion implantation, gasphase doping or cluster beam implantation. When the dopant is introducedduring the epitaxial growth process, the epitaxial growth process can bereferred to as an in-situ epitaxial growth process in which a dopantsource, together with at least one semiconductor source, are used.

In one embodiment of the present application, the at least onesemiconductor source gas used to form each semiconductor mandrelstructure 16 may comprise a Si-containing precursor, such as, forexample, a silane or a disilane, and/or a germanium-containing precursorsuch as, for example, a germane, GeH₄.

In embodiments when different semiconductor materials are used informing the semiconductor mandrel structures 16, at least one firstblock can be formed on at least one region of the structure shown inFIG. 2, and with the at least one first block mask in place at least onesemiconductor mandrel structure containing a first semiconductormaterial is formed by epitaxial growth. The at least one first block canthen be removed and thereafter at least one second block mask can beformed in regions of the structure including the at least onesemiconductor mandrel structure containing the first semiconductormaterial. With the at least one second block mask in place, a secondepitaxial growth process can be performed to provide at least one secondsemiconductor mandrel structure containing a second semiconductormaterial that differs from the first semiconductor material. The atleast one second block mask can then be removed.

In one embodiment, each semiconductor mandrel structure 16 that isformed has a width, as measured from one vertical sidewall surface to anopposing vertical sidewall surface, of from 10 nm to 60 nm. In anotherembodiment, each semiconductor mandrel structure 16 that is formed has awidth, as measured from one vertical sidewall surface to an opposingvertical sidewall surface, of from 10 nm to 40 nm.

Referring now to FIG. 4, there is illustrated the structure of FIG. 3after filling remaining portions of each opening 14, including gap 15,with a dielectric material 18 that differs from the hard mask material.As is shown in FIG. 4, the dielectric material 18 contains portions thatdirectly contact vertical sidewall surfaces of each semiconductormandrel structure 16, other portions that directly contact the topmostsurface of each semiconductor mandrel structure 16, and yet furtherportions that directly contact sidewall surfaces of each hard maskmaterial portion 13.

In one embodiment, the dielectric material 18 can be comprised ofsilicon oxide, a silicon nitride and/or a silicon oxynitride, with theproviso that the dielectric material 18 differs from that used inproviding the layer of hard mask material 12. In one example, and whenthe layer of hard mask material 12 is comprised of silicon nitride, thendielectric material 18 may be comprised of silicon oxide. In anotherexample, and when the layer of hard mask material 12 is comprised ofsilicon oxide, then dielectric material 18 may be comprised of siliconnitride.

The filling of each opening 14 and gap 15 with dielectric material 18can be obtained by deposition of the dielectric material 18 and then anoptional planarization process can be used to provide the planarstructure shown in FIG. 4. In one embodiment, the dielectric material 18can be formed by a deposition process such as, for example, chemicalvapor deposition (CVD), or plasma enhanced chemical vapor deposition(PECVD). In one embodiment, and when a planarization process isemployed, the planarization process may comprise a chemical mechanicalpolishing or etch back process. As shown in FIG. 4, the topmost surfaceof each dielectric material 18 is coplanar with a topmost surface ofeach hard mask material portion 13.

Referring now to FIG. 5, there is illustrated the structure of FIG. 4after removing each hard mask material portion 13 from atop the mesasurfaces 10 m of the semiconductor substrate 10 and then recessing theexposed mesa surfaces 10 m to provide second recessed surfaces 10 r ₂within semiconductor substrate 10. As is shown, each second recessedsurface 10 r ₂ is vertically offset and below each first recessedsurface 10 r ₁ that includes the semiconductor mandrel structures 16 andthe dielectric material 18.

The removal of each hard mask material portion 13 can performedutilizing an etching process that selectively removes each hard maskmaterial portion 13 relative to dielectric material 18. In oneembodiment of the present application, a dry etch process such as, forexample, a reactive ion etch, may be used to selectively remove eachhard mask material portion 13 relative to dielectric material 18. Inanother embodiment of the present application, where the hard maskportion 13 is comprised of silicon nitride, a chemical wet etch processsuch as, for example, a hot phosphoric acid etch, may be used toselectively remove each hard mask material portion 13 relative todielectric material 18.

After removing each hard mask material portion 13, each mesa surface 10m of the semiconductor substrate 10 is exposed. Each exposed mesasurface 10 m is then recessed using dielectric material 18 as an etchmask to provide second recessed surface 10 r ₂. As stated above, eachsecond recessed surface 10 r ₂ of the semiconductor substrate 10 isvertically offset and located beneath each first recessed surface 10 r₁. In one embodiment, the recessing of the mesa surfaces 10 m to providesecond recessed surfaces 10 r ₂ may include a dry etching process suchas, for example, a reactive ion etch. In another embodiment of thepresent application, a chemical wet etch process such as, for example, aKOH or TMAH etch, may be used to recess each mesa surface 10 m toprovide the second recessed surfaces 10 r ₂.

Each first recessed surface 10 r ₁ of the semiconductor substrate 10 maybe referred to herein as a first semiconductor surface, while eachsecond recessed surface 10 r ₂ of semiconductor substrate 10 may bereferred to herein as a second semiconductor surface. In accordance withthe present application, the first semiconductor surface that isprovided by the first recessed surface 10 r ₁ is vertically offset andlocated above the second semiconductor surface that is provided by thesecond recessed surface 10 r ₂. In accordance with the presentapplication, the first and second semiconductor surfaces are connectedto each other by a vertical sidewall portion of the semiconductorsubstrate 10. The semiconductor substrate 10 including the firstsemiconductor surface and the second semiconductor surface can bereferred to herein as a feature-containing semiconductor substrate.

Referring now to FIG. 6, there is illustrated the structure of FIG. 5after removing the dielectric material 18 from the structure leavingsemiconductor mandrel structures 16 atop portions of the first recessedsurfaces 10 r ₁ of semiconductor substrate 10. The removal of dielectricmaterial 18 from the structure shown in FIG. 5 can be performedutilizing an etching process that selectively removes the dielectricmaterial 18 relative to semiconductor material. In one embodiment of thepresent application, a dry etch process such as, for example, a reactiveion etch, may be used to selectively remove the dielectric material 18relative to semiconductor material. In another embodiment of the presentapplication, a chemical wet etch process such as, for example, anHF-based etch, may be used to selectively remove the dielectric material18 relative to semiconductor material.

Referring now to FIG. 7, there is illustrated the structure of FIG. 6after forming first oxide regions 20A on each first recessed surfaces 10r ₁ of the semiconductor substrate 10, second oxide regions 20B on eachsecond recessed surface 10 r ₂ of the semiconductor substrate 10, and anoxide cap 22 on each semiconductor mandrel structure 16.

As is shown, a topmost surface of each second oxide region 20B that ispresent on the second recessed surface 10 r ₂ of the semiconductorsubstrate 10 is vertically offset and located beneath a topmost surfaceof each first oxide region 20A that is present on the first recessedsurface 10 r ₁ of the semiconductor substrate. As is also shown, abottommost surface of each second oxide region 20B directly contacts thesecond recessed surface 10 r ₂ of the semiconductor substrate 10 and thebottommost surface of each first oxide region 20A directly contacts thefirst recessed surface 10 r ₁ of the semiconductor substrate 10. As isfurther shown in FIG. 7, sidewall surfaces of each of the first andsecond oxide regions 10A, 20B directly contact vertical sidewalls ofeach semiconductor mandrel structure 16. The first and second oxideregions 10A, 20B can be referred to as first and second oxide pedestals,respectively.

The oxide cap 22 that can be formed is present on a topmost surface ofeach semiconductor mandrel structure 16 and it has sidewall sidewallsthat are vertically coincident to vertical sidewalls of eachsemiconductor mandrel structure 16.

The first oxide region 20A, the second oxide region 20B and the oxidecap 22 can be formed by a directional deposition process. In oneembodiment of the present application, the direction deposition processmay comprise a high density plasma process. The term “high density”denotes a process where the ion flux to the surface is larger than thenet deposition flux, which means that as the film is deposited it issputtered by the ions. The sputtering profile is in a such a way that adirectional deposition is obtained, i.e., the highest deposition rate isobtained on horizontal surfaces while the lowest deposition rate isobtained on vertical surfaces. In other embodiments, other directionaldeposition processes such as, for example, physical vapor deposition canbe employed.

In one embodiment of the present application, the height of each of thefirst and second oxide regions 20A, 20B, as measured from a bottommostsurface to a topmost surface of each oxide region can be from 30 nm to150 nm. In another embodiment of the present disclosure, the height ofeach of the first and second oxide regions 20A, 20B, as measured from abottommost surface to a topmost surface of each oxide region can be from30 nm to 50 nm. Other heights are also possible so long as the height ofeach first and second oxide region 20A, 20B does not extend above thetopmost surface of each semiconductor mandrel structure.

In some embodiments, not illustrated, at least one block mask can beformed on portions of the structure shown in FIG. 7 such that an oxideregion is formed only on one of the recessed semiconductor surfaces ofsemiconductor substrate 10. In one embodiment, only the first oxideregion 20A is formed on the first recessed surface 10 r ₁ and no oxideregion is formed on the second recessed surface 10 r ₂. In anotherembodiment, only the second oxide region 20B is formed on the secondrecessed surface 10 r ₂ and no oxide region is formed on the firstrecessed surface 10 r ₁.

Referring now to FIG. 8, there is illustrated the structure of FIG. 7after forming semiconductor fins on each oxide region 20A, 20B and onsidewall surfaces of each semiconductor mandrel structure 16. Thesemiconductor fins that are formed on first oxide regions 20A can bereferred to as first semiconductor fins 24A having a first height, h₁,while the semiconductor fins that are formed on the second oxide regions20B can be referred to herein as second semiconductor fins 24B having asecond height, h₂, wherein the second height is different than the firstheight. In one embodiment and as shown in the drawings, the secondheight is greater than the first height. In other embodiments, thesecond height is less than the first height. In the FIG. 8, the firstsemiconductor fins 24A define a set of shorter semiconductor fins thanthe second semiconductor fins 24B.

In some embodiments, each first semiconductor fin 24A may comprise asame or different semiconductor material provided that the semiconductormaterial of each first semiconductor fin 24A is different from thesemiconductor material used in providing the semiconductor mandrelstructures 16. Likewise, each second semiconductor fin 24B may comprisea same or different semiconductor material provided that thesemiconductor material of each second semiconductor fin 24B is differentfrom the semiconductor material used in providing the semiconductormandrel structures 16.

In some other embodiments, each first semiconductor fin 24A may comprisea first semiconductor material, while each second semiconductor fin 24Bmay comprise a second semiconductor material, wherein the first andsecond semiconductor materials can be the same or different. Typically,each first semiconductor fin 24A and each second semiconductor fin 24Bcomprise a same semiconductor material which differs from that of thesemiconductor material used in providing the semiconductor mandrelstructures 16. In one example, and when each semiconductor mandrelstructure 16 comprises a silicon germanium alloy, each firstsemiconductor fin 24A and each second semiconductor fin 24B comprisessilicon. In another example, and when each semiconductor mandrelstructure 16 comprises a silicon germanium alloy, each firstsemiconductor fin 24A comprises SiGe with Ge atomic concentrationsmaller than that of the semiconductor mandrel structure 16 and eachsecond semiconductor fin 24B comprises silicon.

In some embodiments, each first semiconductor fin 24A and each secondsemiconductor fin 24B comprises an intrinsic, i.e., non-dopedsemiconductor material. In other embodiments, each first semiconductorfin 24A and each second semiconductor fin 24B comprises a dopedsemiconductor material. When doped an n-type or a p-type dopant can beintroduced into each first semiconductor fin 24A and each secondsemiconductor fin 24B. It is also within an embodiment of the presentapplication to include some doped semiconductor fins (semiconductor fins24A and/or second semiconductor fin 24B) and some intrinsicsemiconductor fins (the remainder of the first semiconductor fins 24Aand/or second semiconductor fin 24B). When doped, a p-type or n-typedopant can be present with the semiconductor fins 24A, 24B.

In some embodiments, each first semiconductor fin 24A and each secondsemiconductor fin 24B have a same crystal orientation as that of thesidewall surfaces of each semiconductor mandrel structure 16. Each firstsemiconductor fin 24A and each second semiconductor fin 24B can beformed by an epitaxial growth process including the one described abovein forming each semiconductor mandrel structure 16. When a dopant ispresent, an in-situ epitaxial growth process can be used. Alternatively,doping can be achieved by ion implantation or gas phase doping.

In one embodiment, each first semiconductor fin 24A and each secondsemiconductor fin 24B that is formed has a width, as measured from onevertical sidewall surface to an opposing vertical sidewall surface, offrom 5 nm to 20 nm. In another embodiment, each first semiconductor fin24A and each second semiconductor fin 24B that is formed has a width, asmeasured from one vertical sidewall surface to an opposing verticalsidewall surface, of from 5 nm to 10 nm. In some embodiments, the widthof the first and second semiconductor fins 24A, 24B can be the same. Inanother embodiment, variable widths can be achieved for the first andsecond semiconductor fins 24A, 24B.

As is shown in FIG. 8, each first semiconductor fin 24A and each secondsemiconductor fin 24B have topmost surfaces which are coplanar with eachother and coplanar with a topmost surface of each semiconductor mandrelstructure 16. Thus, despite the first semiconductor fins 24A having adifferent height than the second semiconductor fins 24B, each of thevariable height fins 24A, 24B has a same topography, i.e., coplanarsurfaces. Also, and in the embodiment illustrated, each of the first andsecond semiconductor fins are present on an insulator, i.e., oxideregions 220A, 22B, as such the first and second semiconductor fins ofthe illustrated embodiment may be referred to as SOI fins.

In embodiments in which one of the oxide regions 20A, 20B is not formed,then a corresponding same fin is formed directly on the recessedsemiconductor surface of the semiconductor substrate not including theoxide region. In such an embodiment, SOI fins and non-SOI fins ofvariable height are formed, yet each fin has a same topography, i.e.,the topmost surfaces of the SOI fins and non-SOI fins are coplanar witheach other. See, for example, FIGS. 9A and 9B. In FIGS. 9A and 9B theSOI fins are labeled as element 50, while the non-SOI fins are labeledas 52. In FIG. 9A and FIG. 9B, the SOI fins 50 are shorter than thenon-SOI fins 52.

Referring now to FIG. 10, there is illustrated the structure of FIG. 8after removing each oxide cap 22 and each semiconductor mandrelstructure 16 and forming an insulating layer 26 on exposed firstrecessed surfaces 10 r ₁ of the semiconductor substrate previouslyoccupied by the semiconductor mandrel structures 16. It is noted thatthe structures shown in FIGS. 9A-9B may be processed in a like manner asthat of the structure shown in FIG. 9.

Each oxide cap 22 is removed from the structure by a planarizationprocess such as, for example, chemical mechanical polishing, so as toexpose a topmost surface of each semiconductor mandrel structure 16.Each exposed semiconductor mandrel structure 16 is then selectivelyremoved relative to semiconductor material and oxide. In one embodiment,each exposed semiconductor mandrel structure 16 can be removed by a dryetch process such as, for example, a reactive ion etch. In anotherembodiment of the present application, a chemical wet etch process suchas, for example, a H₂O₂-based etch, may be used to selectively removeeach semiconductor mandrel structure 16.

As shown in FIG. 10, a pair of a first semiconductors fin 24A of thefirst height is present on a first oxide region 20A and a pair of secondsemiconductor fins 24B of the second height is present on second oxideregion 20B. As also shown in FIG. 10, each first semiconductor fin 24Aof the first height, and each second semiconductor fin 24B of the secondheight have topmost surfaces that are coplanar with each other. Thus, astructure having variable height semiconductor fins, without anytopography is provided.

Referring now to FIG. 11, there is illustrated the structure of FIG. 10after forming a gate structure 30 straddling each semiconductor fin 24A,24B. The gate structure 30 includes a gate dielectric 32 and a gateelectrode 34.

In some embodiments, the gate dielectric 32 can be a dielectric materialhaving a dielectric constant that is equal to or less than thedielectric constant of silicon oxide. In another embodiment, the gatedielectric 32 can be a high k material having a dielectric constantgreater than silicon oxide. Exemplary high k dielectrics include, butare not limited to, HfO₂, ZrO₂, La₂O₃, Al₂O₃, TiO₂, SrTiO₃, LaAlO₃,Y₂O₃, HfO_(x)N_(y), ZrO_(x)N_(y), La₂O_(x)N_(y), Al₂O_(x)N_(y),TiO_(x)N_(y), SrTiO_(x)N_(y), LaAlO_(x)N_(y), Y₂O_(x)N_(y), SiON,SiN_(x), a silicate thereof, and/or an alloy thereof. Each value of x isindependently from 0.5 to 3 and each value of y is independently from 0to 2. In some embodiments, a multilayered gate dielectric structurecomprising different gate dielectric materials, e.g., silicon oxide, anda high k gate dielectric can be formed.

The gate dielectric 32 can be formed by any deposition techniqueincluding, for example, chemical vapor deposition (CVD), plasma enhancedchemical vapor deposition (PECVD), physical vapor deposition (PVD),sputtering or atomic layer deposition. In one embodiment of the presentapplication, the gate dielectric 32 can have a thickness in a range from1 nm to 10 nm. Other thicknesses that are lesser than or greater thanthe aforementioned thickness range can also be employed for the gatedielectric 32.

After providing the gate dielectric 32, the gate conductor 34 can beformed atop the gate dielectric 32. In one embodiment, the gateconductor 34 can include any conductive metal material including, forexample, an elemental metal (e.g., tungsten, titanium, tantalum,aluminum, nickel, ruthenium, palladium or platinum), an alloy of atleast two elemental metals, an elemental metal nitride (e.g., tungstennitride, aluminum nitride, or titanium nitride), an elemental metalsilicide (e.g., tungsten silicide, nickel silicide, or titaniumsilicide) and multilayered combinations thereof. The gate conductor 34can be formed utilizing a deposition process including, for example,chemical vapor deposition (CVD), plasma enhanced chemical vapordeposition (PECVD), physical vapor deposition (PVD), sputtering, atomiclayer deposition (ALD) or other like deposition processes. When a metalsilicide is formed, a conventional silicidation process is employed. Inone embodiment, the gate conductor 46 has a thickness from 1 nm to 100nm. Other thicknesses that are lesser than or greater than theaforementioned thickness range can also be employed for the gateconductor 34.

In some embodiments a replacement gate process can be used, in which adummy gate for example comprising of silicon dioxide and polysilicon isfirst deposited and patterned and is replaced with the desired gatematerial at a later step in the fabrication process.

In some embodiments, block mask technology can be employed to providegate structures 30 that include different gate dielectrics 32 and/ordifferent gate conductors 34.

Following the formation of the gate structure 30, gate spacers can beformed on sidewall surfaces of the gate structure 30, and thereaftersource/drain regions can be formed into each exposed portion of thefirst and second semiconductor fins 24A, 24B not including the gatestructure 30 or gate spacer. The gate spacers can be formed bydeposition of a spacer material such as an oxide and/or nitride, and theetching the deposited spacer material. The source/drain regions can beformed by an angled ion implantation process or gas phase doping.Following the formation of the source/drain regions, end portions ofeach of the first and semiconductor fins 24A, 24B can be merged byepitaxial deposition of a semiconductor material. The gate spacers,source/drain regions and semiconductor material used in merging the finsare not shown in the drawings so as not to obscure the presentapplication.

FIG. 11 thus shows a semiconductor structure in accordance with anembodiment of the present application that includes a semiconductorsubstrate 10 comprising a first semiconductor surface (represented byfirst recessed surface 10 r ₁) and a second semiconductor surface(represented by second recessed surface 10 r ₂), wherein the firstsemiconductor surface is vertically offset and located above the secondsemiconductor surface. An oxide region 20A and/or 20B is locateddirectly on the first semiconductor surface and/or the secondsemiconductor surface. A first set of first semiconductor fins 24Ahaving a first height is located above the first semiconductor surfaceof the semiconductor substrate 10. A second set of second semiconductorfins 24B having a second height is located above the secondsemiconductor surface, wherein the second height is different than thefirst height and wherein each first semiconductor fin 24A and eachsecond semiconductor fin 24B has a topmost surface, and the topmostsurfaces of the first and second semiconductor fins are coplanar witheach other. Variations of the structure shown in FIG. 11 can be obtainedby using the various embodiments of the present application. Forexample, variations of the structure shown in FIG. 11 can be obtainedusing the structure shown in FIG. 9A or 9B instead of the structureshown in FIG. 8.

FIG. 12 is a pictorial representation (through a top down view)illustrating a static random access memory (SRAM) device 100 formedusing the processing steps of the present application. In this drawing,element 102 define semiconductor fins having a first height, element 104define second semiconductor fins having a second height wherein thesecond height is greater than the first height, and element 106 definesthe gate structure 30.

While the present application has been particularly shown and describedwith respect to preferred embodiments thereof, it will be understood bythose skilled in the art that the foregoing and other changes in formsand details may be made without departing from the spirit and scope ofthe present application. It is therefore intended that the presentapplication not be limited to the exact forms and details described andillustrated, but fall within the scope of the appended claims.

1. A semiconductor structure comprising: a semiconductor substratecomprising a first semiconductor surface and a second semiconductorsurface, wherein said first semiconductor surface is vertically offsetand located above said second semiconductor surface; an oxide regionlocated directly on at least one of the first semiconductor surface andthe second semiconductor surface; a first set of first semiconductorfins having a first height located above said first semiconductorsurface of the semiconductor substrate; and a second set of secondsemiconductor fins having a second height located above the secondsemiconductor surface, wherein the second height is different than thefirst height and wherein each first semiconductor fin and each secondsemiconductor fin has a topmost surface, and the topmost surfaces of thefirst and second semiconductor fins are coplanar with each other.
 2. Thesemiconductor structure of claim 1, wherein said oxide region is onlylocated directly on said first semiconductor surface of thesemiconductor substrate.
 3. The semiconductor structure of claim 1,wherein said oxide region is only located directly on said secondsemiconductor surface of the semiconductor substrate.
 4. Thesemiconductor structure of claim 1, wherein said oxide region is locateddirectly on both said first semiconductor surface and the secondsemiconductor surface.
 5. The semiconductor structure of claim 1,wherein an insulator layer is located on a portion of the firstsemiconductor surface not including said first set of firstsemiconductor fins.
 6. The semiconductor structure of claim 1, whereineach semiconductor fin of the first and second sets is comprised ofsilicon.
 7. The semiconductor structure of claim 1, further comprising agate structure straddling each first semiconductor fin and each secondsemiconductor fin.
 8. The semiconductor structure of claim 7, whereinsaid gate structure includes a gate dielectric and a gate conductor. 9.The semiconductor structure of claim 8, wherein said gate dielectric ispresent on vertical sidewall surfaces and the topmost surface of each ofsaid first and second semiconductor fins.
 10. The semiconductorstructure of claim 1, wherein said semiconductor substrate comprises abulk semiconductor material.
 11. A semiconductor structure comprising: abulk semiconductor substrate comprising a first semiconductor surfaceand a second semiconductor surface, wherein said first semiconductorsurface is vertically offset and located above said second semiconductorsurface; a first oxide region located directly on the firstsemiconductor surface; a second oxide region located directly on thesecond semiconductor surface, wherein the first oxide region has atopmost surface that is vertically offset and located above a topmostsurface of the second oxide region; a first set of first semiconductorfins having a first height located directly on the topmost surface ofsaid first oxide region; and a second set of second semiconductor finshaving a second height located directly on the topmost surface of thesecond oxide region, wherein the second height is greater than the firstheight and wherein each first semiconductor fin and each secondsemiconductor fin has a topmost surface, and the topmost surfaces of thefirst and second semiconductor fins are coplanar with each other.12.-20. (canceled)